Circuit and method for generating pumping voltage in semiconductor memory apparatus and semiconductor memory apparatus using the same

ABSTRACT

A circuit for generating a pumping voltage in a semiconductor memory apparatus includes a control signal generation block configured to generate a first control signal obtained by level-shifting a voltage level of a test signal to a first driving voltage level, a voltage application section configured to supply an external voltage to a first node in response to a first transmission signal, a first charge pump configured to raise a voltage level of the first node by a first predetermined level in response to an oscillator signal, and a first pumping voltage output section configured to select at least one of a first connection unit and a second connection unit in response to the first control signal, and to interconnect the first node with a second node using the selected connection unit when a second transmission signal is enabled, wherein a first pumping voltage is output through the second node.

CROSS-REFERENCES TO RELATED APPLICATION

The present application claims priority under 35 U.S.C. §119(a) toKorean application number 10-2008-0043022, filed on May 8, 2008, in theKorean Intellectual Property Office, which is incorporated herein byreference in its entirety as set forth in full.

BACKGROUND

1. Technical Field

The embodiments described herein relate to a semiconductor memoryapparatus, and more particularly, to a circuit and a method forgenerating a pumping voltage and a semiconductor memory apparatus usingthe same.

2. Related Art

In a semiconductor memory apparatus a pumping voltage (VPP) is requiredwhen storing or outputting data in order to prevent the loss of a datalevel. Accordingly, most semiconductor memory apparatuses have a pumpingvoltage generation circuit and a pumping voltage sensing device.

FIG. 1 is a schematic view of a conventional circuit 1 for generating apumping voltage in a semiconductor memory apparatus. In FIG. 1, thepumping voltage generation circuit 1 includes first and secondcapacitors C1 and C2, and first through third transistors N1 through N3.

The first capacitor C1 generates a first boot voltage V_boot1 inresponse to an oscillator signal ‘osc’, and the second capacitor C2generates a second boot voltage V_boot2 in response to an invertedoscillator signal ‘oscb’. The first transistor N1 outputs an externalvoltage VDD to a first node (nodeA) when a first transmission signal‘trans1’ is enabled. In general, in a transistor, the level of a voltagethat is output from a drain region to a source region changes dependingupon the level of the voltage supplied to a gate terminal. Accordingly,the voltage level of the enabled first transmission signal ‘trans1’represents a voltage level that allows the external voltage VDD to bemost efficiently output to the first node (nodeA) without a voltagedrop.

The second transistor N2 outputs the voltage of the first node (nodeA)to a second node (nodeB) when a second transmission signal ‘trans2’ isenabled. The voltage level of the enabled second transmission signal‘trans2’ represents a voltage level that allows the voltage of the firstnode (nodeA) to be most efficiently output to the second node (nodeB)without a voltage drop.

The third transistor N3 outputs the voltage of the second node (nodeB)as a pumping voltage VPP when a third transmission signal ‘trans3’ isenabled. The voltage level of the enabled third transmission signal‘trans3’ represents a voltage level that allows the voltage of thesecond node (nodeB) to be most efficiently output as the pumping voltageVPP without a voltage drop. The voltage levels of the enabled firstthrough third transmission signals ‘trans1’ through ‘trans3’ aredifferent from one another. The voltage level of the enabled firsttransmission signal ‘trans1’ is lowest, and the voltage level of theenabled third transmission signal ‘trans3’ is highest.

A conventional operation of the pumping voltage generation circuit 1will be described with reference to FIG. 1.

As the first transmission signal ‘trans1’ is enabled, the firsttransistor N1 is turned ON. Since the external voltage VDD is suppliedto the first node (nodeA), the voltage level of the first node (nodeA)transitions to the level of the external voltage VDD. When the voltagelevel of the first node (nodeA) becomes the level of the externalvoltage VDD, the first transmission signal ‘trans1’ is disabled, and thefirst transistor N1 is turned OFF.

The oscillator signal ‘osc’ swings between the level of the externalvoltage VDD and a ground level. When the oscillator signal ‘osc’transitions to the external voltage VDD, the first capacitor C1 outputsthe first boot voltage V_boot1 having the level of the external voltageVDD to the first node (nodeA). Accordingly, the voltage level of thefirst node (nodeA) is the sum of the first boot voltage ‘V_boot1’ andthe external voltage VDD. In this case, the voltage on node A will betwice the level of the external voltage VDD.

As the second transmission signal ‘trans2’ is enabled, the secondtransistor N2 is turned ON, connecting the first node (nodeA) and thesecond node (nodeB). Thus, the voltage level of the second node (node B)will transition to the level of the voltage on node A.

The inverted oscillator signal ‘oscb’ also swings between a ground leveland the level of the external voltage VDD. When the inverted oscillatorsignal ‘oscb’ transitions to the external voltage VDD, the secondcapacitor C2 outputs the second boot voltage V_boot2 having the level ofthe external voltage VDD to the second node (nodeB). Accordingly, thevoltage level of the second node (nodeB) becomes the sum of the voltageon node A and the second boot voltage ‘V_boot2’. In this case, thevoltage level on node B will be three times the level of the externalvoltage VDD.

As the third transmission signal ‘trans3’ is enabled, the thirdtransistor N3 is turned ON. When the third transistor N3 is turned ON,the voltage of the second node (nodeB) is output as the pumping voltageVPP. Here, the level of the pumping voltage VPP will be three times thelevel of the external voltage VDD.

In the pumping voltage generation circuit 1, a pumping voltagegeneration efficiency changes depending upon how efficiently the secondtransistor N2 and the third transistor N3 transmit the various voltages.Even when the sizes of the transistors are designed to most efficientlytransmit the voltages, if the sizes of the transistors change due toprocess variations, the efficiency of the pumping voltage generationcircuit decreases compared to a designed efficiency.

The pumping voltage generation efficiency is defined by the ratiobetween an amount of current used by the pumping voltage generationcircuit and an amount of current used by charge pumps, i.e., the firstand second capacitors C1 and C2.

SUMMARY

A circuit and method for generating a pumping voltage in a semiconductormemory apparatus capable of reducing power consumption and asemiconductor memory apparatus using the same are described herein.

In one aspect, a circuit for generating a pumping voltage in asemiconductor memory apparatus comprises a voltage application sectionconfigured to supply an external voltage to a first node in response toa first transmission signal, a first charge pump configured to raise avoltage level of the first node by a first predetermined level inresponse to an oscillator signal, and a first pumping voltage outputsection comprising a plurality of connection units, each of theplurality of connection units configured to interconnect the first nodewith a second node when a second transmission signal is enabled.

In another aspect, a method for generating a pumping voltage in asemiconductor memory apparatus includes supplying an external voltage toa first node in response to a first transmission signal, raising avoltage level of the first node by a first predetermined level inresponse to an oscillator signal, selecting at least one of a firstconnection unit and a second connection unit in response to a testsignal in a test, interconnecting the first node and a second node bythe selected connection unit when a second transmission signal isenabled, and fixing one of the first connection unit and the secondconnection unit through fuse cutting after the test is finished tointerconnect the first node and the second node, wherein a first pumpingvoltage is output through the second node.

In another aspect, a semiconductor memory apparatus includes a pumpingvoltage generating circuit having a control signal generation blockconfigured to generate a plurality of control signals, each obtained bylevel-shifting a voltage level of a test signal to one of a firstdriving voltage level and a second driving voltage level, a voltageapplication section configured to supply an external voltage to aplurality of nodes in response to a plurality of transmission signals, aplurality of charge pumps, each configured to raise a voltage level of afirst node of the plurality of nodes by a first predetermined level inresponse to an oscillator signal and a second node of the plurality ofnodes by a second predetermined level in response to an invertedoscillator signal, and a plurality of pumping voltage output sections,each configured to select at least one of first and second connectionunits in response to a first control signal of the plurality of controlsignals to interconnect the first node with the second node using theselected connection unit when a second transmission signal of theplurality of transmission signals is enabled, and to select at least oneof third and fourth connection units in response to the second controlsignal to interconnect the second node and a third node of the pluralityof nodes using the selected connection unit when a third transmissionsignal of the plurality of transmission signals is enabled, wherein oneof a first pumping voltage and a second pumping voltage is outputthrough one of the second node and the third node, respectively, to thesemiconductor memory apparatus.

These and other features, aspects, and embodiments are described belowin the section “Detailed Description.”

BRIEF DESCRIPTION OF THE DRAWINGS

Features, aspects, and embodiments are described in conjunction with theattached drawings, in which:

FIG. 1 is a schematic view of a conventional circuit for generating apumping voltage in a semiconductor memory apparatus;

FIG. 2 is a schematic view of an exemplary circuit for generating apumping voltage in a semiconductor memory apparatus according to oneembodiment;

FIG. 3 is a schematic view of a control signal generation block capableof being implemented in the circuit of FIG. 2 according to oneembodiment; and

FIG. 4 is a schematic view of a pumping voltage generation block capableof being implemented in the circuit of FIG. 2 according to oneembodiment.

DETAILED DESCRIPTION

FIG. 2 is a schematic view of an exemplary circuit 10 for generating apumping voltage in a semiconductor memory apparatus according to oneembodiment. In FIG. 2, the exemplary circuit 10 can include a controlsignal generation block 100 and a pumping voltage generation block 200.

The control signal generation block 100 can be configured to level-shiftfirst through third test signals ‘Test1’ through ‘Test3’ using first andsecond driving voltages V_drv1 and V_drv2, and can generate firstthrough sixth control signals ‘ctrl1<1:2>’, ‘ctrl2<1:2>’ and‘ctrl3<1:2>’. For example, the first and second control signals‘ctrl1<1:2>’ can be signals that can be respectively obtained bylevel-shifting the first test signal ‘Test1’ using the first and seconddriving voltages V_drv1 and V_drv2. In addition, the third and fourthcontrol signals ‘ctrl2<1:2>’ can be signals that can be respectivelyobtained by level-shifting the second test signal ‘Test2’ using thefirst and second driving voltages V_drv1 and V_drv2. Moreover, the fifthand sixth control signals ‘ctrl3<1:2>’ can be signals that can berespectively obtained by level-shifting the third test signal ‘Test3’using the first and second driving voltages V_drv1 and V_drv2.

The pumping voltage generation block 200 can be configured to implementpumping operation in response to the first through sixth control signals‘ctrl1<1:2>’, ‘ctrl2<1:2>’ and ‘ctrl3<1:2>’, first through thirdtransmission signals ‘trans1’ through ‘trans3’, and oscillator signals‘osc’ and ‘oscb’, and can generate a pumping voltage VPP as a result ofthe pumping operation.

FIG. 3 is a schematic view of a control signal generation block 100capable of being implemented in the circuit of FIG. 2 according to oneembodiment. In FIG. 3, the control signal generation block 100 caninclude first through sixth level shifters 110 through 160.

The first level shifter 110 can level-shift the first test signal‘Test1’ using the level of the first driving voltage V_drv1, and cangenerate the first control signal ‘ctrl1<1>’.

The second level shifter 120 can level-shift the second test signal‘Test2’ using the level of the first driving voltage V_drv1, and cangenerate the third control signal ‘ctrl2<1>’.

The third level shifter 130 can level-shift the third test signal‘Test3’ using the level of the first driving voltage V_drv1, and cangenerate the fifth control signal ‘ctrl3<1>’.

The fourth level shifter 140 can level-shift the first test signal‘Test1’ using the level of the second driving voltage V_drv2, and cangenerate the second control signal ‘ctrl1<2>’.

The fifth level shifter 150 can level-shift the second test signal‘Test2’ using the level of the second driving voltage V_drv2, and cangenerate the fourth control signal ‘ctrl2<2>’.

The sixth level shifter 160 can level-shift the third test signal‘Test3’ using the level of the second driving voltage V_drv2, and cangenerate the sixth control signal ‘ctrl3<2>’.

Here, for example, the level of the second driving voltage V_drv2 can behigher than the level of the first driving voltage V_drv1.

FIG. 4 is a schematic view of a pumping voltage generation block 200capable of being implemented in the circuit of FIG. 2 according to oneembodiment. In FIG. 4, the pumping voltage generation block 200 can beconfigured to include a voltage application section 210, first andsecond charge pumps 220 and 240, a first pumping voltage output section230, and a second pumping voltage output section 250.

The voltage application section 210 can supply an external voltage VDDto a first node (nodeA) when the first transmission signal ‘trans1’ isenabled. For example, the voltage application section 210 can include afirst transistor N11 having a gate terminal receiving the firsttransmission signal ‘trans1’, a drain terminal receiving the externalvoltage ‘VDD’, and a source terminal connected to the first node(nodeA).

The first charge pump 220 can be configured to generate a first bootvoltage V_boot1 during the high interval of the oscillator signal ‘osc’,and can supply the first boot voltage V_boot1 to the first node (nodeA).For example, the first charge pump 220 can include a first capacitor C11having one terminal receiving the oscillator signal ‘osc’ and a secondterminal connected to the first node (nodeA). Here, for example, thefirst boot voltage V_boot1 can be output through the other terminal ofthe first capacitor C11.

In FIG. 4, the first pumping voltage output section 230 can beconfigured to include first through third connection units 231, 232 and233.

The first connection unit 231 can be configured to be selected when thefirst control signal ‘ctrl1<1>’ is enabled, and can interconnect thefirst node (nodeA) and a second node (nodeB) when the secondtransmission signal ‘trans2’ is enabled. The first connection unit 231can include a first selection part 231-1 and a first transmission part231-2.

The first selection part 231-1 can interconnect the first node (nodeA)and the first transmission part 231-2 when the first control signal‘ctrl1<1>’ is enabled. For example, the first selection part 231-1 caninclude a second transistor N12 having a gate terminal receiving thefirst control signal ‘ctrl1<1>’, a drain terminal connected to the firstnode (nodeA), and a source terminal connected to the first transmissionpart 231-2.

In addition, the first transmission part 231-2 can connect the firstselection part 231-1 and the second node (nodeB) when the secondtransmission signal ‘trans2’ is enabled. For example,

the first transmission part 231-2 can include a third transistor N13having a gate terminal receiving the second transmission signal‘trans2’, a drain terminal connected to the first selection part 231-1,and a source terminal connected to the second node (nodeB).

The second connection unit 232 can be configured to be selected when thethird control signal ‘ctrl2<1>’ is enabled, and can interconnect thefirst node (nodeA) and the second node (nodeB) when the secondtransmission signal ‘trans2’ is enabled. For example, the secondconnection unit 232 can be configured to include a second selection part232-1 and a second transmission part 232-2.

The second selection part 232-1 can connect the first node (nodeA) andthe second transmission part 232-2 when the third control signal‘ctrl2<1>’ is enabled. For example, the second selection part 232-1 caninclude a fourth transistor N14 having a gate terminal receiving thethird control signal ‘ctrl2<1>’, a drain terminal connected to the firstnode (nodeA), and a source terminal connected to the second transmissionpart 232-2.

The second transmission part 232-2 can connect the second selection part232-1 and the second node (nodeB) when the second transmission signal‘trans2’ is enabled. For example, the second transmission part 232-2 caninclude a fifth transistor N15 having a gate terminal receiving thesecond transmission signal ‘trans2’, a drain terminal connected to thesecond selection part 232-1, and a source terminal connected to thesecond node (nodeB).

The third connection unit 233 can be configured to be selected when thefifth control signal ‘ctrl3<1>’ is enabled, and can interconnect thefirst node (nodeA) and the second node (nodeB) when the secondtransmission signal ‘trans2’ is enabled. For example, the thirdconnection unit 233 can include a third selection part 233-1 and a thirdtransmission part 233-2.

In addition, the third selection part 233-1 can connect the first node(nodeA) and the third transmission part 233-2 when the fifth controlsignal ‘ctrl3<1>’ is enabled. For example, the third selection part233-1 can include a sixth transistor N16 having a gate terminalreceiving the fifth control signal ‘ctrl3<1>’, a drain terminalconnected to the first node (nodeA), and a source terminal connected tothe third transmission part 233-2.

In addition, the third transmission part 233-2 can connect the thirdselection part 233-1 and the second node (nodeB) when the secondtransmission signal ‘trans2’ is enabled. For example,

the third transmission part 233-2 can include a seventh transistor N17having a gate terminal receiving the second transmission signal‘trans2’, a drain terminal connected to the third selection part 233-1,and a source terminal connected to the second node (nodeB).

In FIG. 4, the second charge pump 240 can be configured to generate asecond boot voltage V_boot2 during the high interval of the invertedoscillator signal ‘oscb’, and can supply the second boot voltage V_boot2to the second node (nodeB). For example,

the second charge pump 240 can include a second capacitor C12 having oneterminal receiving the inverted oscillator signal ‘oscb’ and a secondterminal connected to the second node (nodeB). Here, for example, thesecond boot voltage V_boot2 can be output through the second terminal ofthe second capacitor C12.

The second pumping voltage output section 250 can include fourth throughsixth connection units 251, 252 and 253.

The fourth connection unit 251 can be configured to be selected when thesecond control signal ‘ctrl1<2>’ is enabled, and can connect the secondnode (nodeB) and an output node (node_out) when the third transmissionsignal ‘trans3’ is enabled. For example, the fourth connection unit 251can include a fourth selection part 251-1 and a fourth transmission part251-2.

The fourth selection part 251-1 can connect the second node (nodeB) andthe fourth transmission part 251-2 when the second control signal‘ctrl1<2>’ is enabled. For example, the fourth selection part 251-1 caninclude an eighth transistor N18 having a gate terminal receiving thesecond control signal ‘ctrl1<2>’, a drain terminal connected to thesecond node (nodeB), and a source terminal connected to the fourthtransmission part 251-2.

The fourth transmission part 251-2 can connect the fourth selection part251-1 and the output node (node_out) when the third transmission signal‘trans3’ is enabled. For example, the fourth transmission part 251-2 caninclude a ninth transistor N19 having a gate terminal receiving thethird transmission signal ‘trans3’, a drain terminal connected to thefourth selection part 251-1, and a source terminal connected to theoutput node (node_out).

The fifth connection unit 252 can be configured to be selected when thefourth control signal ‘ctrl2<2>’ is enabled, and can interconnect thesecond node (nodeB) and the output node (node_out) when the thirdtransmission signal ‘trans3’ is enabled. For example, the fifthconnection unit 252 can include a fifth selection part 252-1 and a fifthtransmission part 252-2.

The fifth selection part 252-1 can connect the second node (nodeB) andthe fifth transmission part 252-2 when the fourth control signal‘ctrl2<2>’ is enabled. For example, the fifth selection part 252-1 caninclude a tenth transistor N20 having a gate terminal receiving thefourth control signal ‘ctrl2<2>’, a drain terminal connected to thesecond node (nodeB), and a source terminal connected to the fifthtransmission part 252-2.

The fifth transmission part 252-2 can connect the fifth selection part252-1 and the output node (node_out) when the third transmission signal‘trans3’ is enabled. For example, the fifth transmission part 252-2 caninclude an eleventh transistor N21 having a gate terminal receiving thethird transmission signal ‘trans3’, a drain terminal connected to thefifth selection part 252-1, and a source terminal connected to theoutput node (node_out).

The sixth connection unit 253 can be configured to be selected when thesixth control signal ‘ctrl3<2>’ is enabled, and can interconnect thesecond node (nodeB) and the output node (node_out) when the thirdtransmission signal ‘trans3’ is enabled. For example, the sixthconnection unit 253 can include a sixth selection part 253-1 and a sixthtransmission part 253-2.

The sixth selection part 253-1 can connect the second node (nodeB) andthe sixth transmission part 253-2 when the sixth control signal‘ctrl3<2>’ is enabled. For example, the sixth selection part 253-1 caninclude a twelfth transistor N22 having a gate terminal receiving thesixth control signal ‘ctrl3<2>’, a drain terminal connected to thesecond node (nodeB), and a source terminal connected to the sixthtransmission part 253-2.

The sixth transmission part 253-2 can connect the sixth selection part253-1 and the output node (node_out) when the third transmission signal‘trans3’ is enabled. Here, for example, the pumping voltage VDD can beoutput through the output node (node_out). For example, the sixthtransmission part 253-2 can include a thirteenth transistor N23 having agate terminal receiving the third transmission signal ‘trans3’, a drainterminal connected to the sixth selection part 253-1, and a sourceterminal connected to the output node (node_out).

Accordingly, the level of the first driving voltage V_drv1 can besubstantially the same as the voltage level of the enabled secondtransmission signal ‘trans2’. In addition, the level of the seconddriving voltage V_drv2 can be substantially the same as the voltagelevel of the enabled third transmission signal ‘trans3’. Here, forexample, the second driving voltage V_drv2 can have substantially thesame level as the first driving voltage V_drv1.

An exemplary operation of the circuit 10 for generating a pumpingvoltage in a semiconductor memory apparatus will be described withreference to FIGS. 2-4.

The circuit 10 for generating a pumping voltage can be configured suchthat a node for generating the pumping voltage VPP can be changed inresponse to the first through third test signals ‘Test1’ through ‘Test3’during a test.

For example, if the first test signal ‘Test1’ is enabled, then the firstnode (nodeA) and the second node (nodeB) can be interconnected throughthe first connection unit 231. In addition, the second node (nodeB) andthe output node (node_out) can be interconnected through the fourthconnection unit 251.

If the second test signal ‘Test2’ is enabled, then the first node(nodeA) and the second node (nodeB) can be interconnected through thesecond connection unit 232. In addition, the second node (nodeB) and theoutput node (node_out) can be interconnected through the fifthconnection unit 252.

If the third test signal ‘Test3’ is enabled, then the first node (nodeA)and the second node (nodeB) can be interconnected through the thirdconnection unit 233. In addition, the second node (nodeB) and the outputnode (node_out) can be interconnected through the sixth connection unit253.

When the first test signal ‘Test1’ is enabled, an exemplary operation ofthe circuit 10 for generating a pumping voltage generation circuit for asemiconductor memory apparatus will be explained with reference to FIGS.2-4.

As the first transmission signal ‘trans1’ is enabled, the externalvoltage ‘VDD’ can be supplied to the first node (nodeA). Accordingly,the voltage of the first node (nodeA) can become the level of theexternal voltage VDD. Accordingly, when the voltage level of the firstnode (nodeA) becomes the level of the external voltage VDD, the firsttransmission signal ‘trans1’ can be disabled.

The first charge pump 220 can generate the first boot voltage V_boot1 inresponse to the oscillator signal ‘osc’ at the timing when the firsttransmission signal ‘trans1’ is disabled, and can supply the first bootvoltage V_boot1 to the first node (nodeA). Accordingly, the voltagelevel of the first node (nodeA) can become the summed level of theexternal voltage VDD and the first boot voltage V_boot1.

Since the first test signal ‘Test1’ is enabled, if the secondtransmission signal ‘trans2’ is enabled, then the first node (nodeA) andthe second node (nodeB) can be interconnected through the firstconnection unit 231. Consequently, if the second transmission signal‘trans2’ is enabled, then the second node (nodeB) can have substantiallythe same voltage level as the first node (nodeA).

If the voltage level of the second node (nodeB) becomes substantiallythe same as the voltage level of the first node (nodeA), then the secondtransmission signal ‘trans2’ can be disabled. In addition, the secondcharge pump 240 can generate the second boot voltage V_boot2 in responseto the inverted oscillator signal ‘oscb’ at the timing when the secondtransmission signal ‘trans2’ is disabled, and can supply the second bootvoltage V_boot2 to the second node (nodeB). Accordingly, the voltagelevel of the second node (nodeB) can become the summed level of theexternal voltage VDD, the first boot voltage V_boot1, and the secondboot voltage V_boot2.

Since the first test signal ‘Test1’ is in the enabled state, if thethird transmission signal ‘trans3’ is enabled, then the second node(nodeB) and the output node (node_out) can be interconnected through thefourth connection unit 251. Accordingly, the voltage level of the outputnode (node_out) can become the summed level of the external voltage VDD,the first boot voltage V_boot1, and the second boot voltage V_boot2.

Presuming that the respective levels of the first boot voltage V_boot1and the second boot voltage V_boot2 are substantially the same as thelevel of the external voltage VDD, the voltage level of the output node(node_out) can become three times the level of the external voltage VDD.Here, for example, the pumping voltage VPP can be output through theoutput node (node_out).

In the circuit 10 (in FIG. 2), if the second test signal ‘Test2’ isenabled, then the pumping voltage VPP can be generated through thesecond connection unit 232 and the fifth connection unit 252. Inaddition, if the third test signal ‘Test3’ is enabled, then the pumpingvoltage VPP can be generated through the third connection unit 233 andthe sixth connection unit 253.

Moreover, the pumping voltage ‘VPP’ can be generated through the firstand second connection units 231 and 232 and the fourth and fifthconnection units 251 and 252 by simultaneously enabling the first andsecond test signals ‘Test1’ and ‘Test2’. Accordingly, in the circuit 10,the pumping voltage ‘VPP’ can be generated by controlling the number ofconnection units for interconnecting the first node (nodeA) and thesecond node (nodeB), and the number of connection units forinterconnecting the second node (nodeB) and the output node (node_out).

By performing a test such that the pumping voltage VPP is generatedusing the transistors N12 through N23 constituting the first throughsixth connection units 231 through 233 and 251 through 253, which can beconfigured to have different sizes, it is possible to find a connectionunit that is most efficient in generating the pumping voltage VPP.Accordingly, if the most efficient connection unit is selected, then thelevel of the corresponding test signal for selecting the connection unitcan be fixed through fuse cutting, for example.

Accordingly, in the circuit 10 for generating a pumping voltage in asemiconductor memory apparatus, even when the sizes of transistors arechanged due to process variations, it is possible to establish a pumpingvoltage generation efficiency since a node from which a designed pumpingvoltage is generated can be selected using test signals. In addition,since a pumping voltage generation efficiency can be maximizedirrespective of process variations, power consumption for generating apumping voltage can be reduced.

While certain embodiments have been described above, it will beunderstood that the embodiments described are by way of example only.Accordingly, the device and methods described herein should not belimited based on the described embodiments. Rather, the device andmethods described herein should only be limited in light of the claimsthat follow when taken in conjunction with the above description andaccompanying drawings.

1. A circuit for generating a pumping voltage in a semiconductor memoryapparatus, comprising: a voltage application section configured tosupply an external voltage to a first node in response to a firsttransmission signal; a first charge pump configured to raise a voltagelevel of the first node by a first predetermined level in response to anoscillator signal; and a first pumping voltage output section comprisinga plurality of connection units, each of the plurality of connectionunits configured to interconnect the first node with a second node whena second transmission signal is enabled.
 2. The circuit according toclaim 1, further comprising a control signal generation block configuredto generate a plurality of control signals obtained by level-shifting avoltage level of a plurality of test signals to a plurality of drivingvoltage levels respectively, wherein the plurality of control signalsare used to enable the plurality of connection units.
 3. The circuitaccording to claim 1, wherein a voltage level of the second transmissionsignal, when enabled, is higher than a voltage level of the firsttransmission signal, when enabled.
 4. The circuit according to claim 2,wherein a first driving voltage level of the plurality of drivingvoltage levels is substantially the same as a voltage level of thesecond transmission signal.
 5. The circuit according to claim 2, whereinthe control signal generation block is configured such that a voltagelevel of a first control signal that is enabled by level-shifting one ofthe test signal to a first driving voltage level is substantially thesame as the voltage level of the enabled second transmission signal. 6.The circuit according to claim 5, wherein the control signal generationblock includes a level shifter that level-shifts the test signal to thefirst driving voltage level and generates the first control signal. 7.The circuit according to claim 1, wherein each of the plurality ofconnection units includes: a selection part configured to output avoltage of the first node in response to one of the plurality of controlsignals; and a transmission part configured to output an output of theselection part to the second node in response to the second transmissionsignal.
 8. The circuit according to claim 7, wherein the selection partand the transmission part include a plurality of transistors.
 9. Thecircuit according to claim 1, further comprising a second charge pumpconfigured to raise a voltage level of the second node by a secondpredetermined level in response to an inverted oscillator signal. 10.The circuit of claim 4, further comprising a second pumping voltageoutput section comprising a second plurality of connection units, eachof the plurality of second connection units configured to interconnectthe second node and a third node when a third transmission signal isenabled node.
 11. The circuit according to claim 10, wherein a seconddriving voltage level of the plurality of driving voltage levels ishigher than the first driving voltage level, and is substantially thesame as a voltage level of the enabled third transmission signal. 12.The circuit according to claim 10, wherein each of the second pluralityof connection units includes: a selection part configured to output avoltage of the second node in response to a second control signal; and atransmission part configured to output an output of the selection partto the third node in response to the third transmission signal.
 13. Thecircuit according to claim 12, wherein the selection part and thetransmission part include a plurality of transistors.
 14. A method forgenerating a pumping voltage in a semiconductor memory apparatus,comprising: supplying an external voltage to a first node in response toa first transmission signal; raising a voltage level of the first nodeby a first predetermined level in response to an oscillator signal;selecting at least one of a first connection unit and a secondconnection unit in response to a test signal in a test; interconnectingthe first node and a second node by the selected connection unit when asecond transmission signal is enabled; and fixing one of the firstconnection unit and the second connection unit through fuse cuttingafter the test is finished to interconnect the first node and the secondnode, wherein a first pumping voltage is output through the second node.15. The method according to claim 14, wherein the selecting at least oneof a first connection unit and a second connection unit includeslevel-shifting the test signal to a voltage level of the secondtransmission signal.
 16. The method according to claim 14, furthercomprising: raising a voltage level of the second node by a secondpredetermined level in response to an inverted oscillator signal;selecting at least one of a third connection unit and a fourthconnection unit in response to the test signal in the test;interconnecting the second node and a third node by the selectedconnection unit when a third transmission signal is enabled; and fixingone of the third connection unit and the fourth connection unit throughfuse cutting after the test is finished to interconnect the second nodeand the third node, wherein a second pumping voltage is output throughthe third node.
 17. The method according to claim 16, wherein selectingat least one of a third connection unit and a fourth connection unitincludes level-shifting the test signal to a voltage level of the thirdtransmission signal.
 18. A semiconductor memory apparatus, comprising: apumping voltage generating circuit including: a control signalgeneration block configured to generate a plurality of control signals,each obtained by level-shifting a voltage level of a test signal to oneof a first driving voltage level and a second driving voltage level; avoltage application section configured to supply an external voltage toa plurality of nodes in response to a plurality of transmission signals;a plurality of charge pumps, each configured to raise a voltage level ofa first node of the plurality of nodes by a first predetermined level inresponse to an oscillator signal and a second node of the plurality ofnodes by a second predetermined level in response to an invertedoscillator signal; and a plurality of pumping voltage output sections,each configured to select at least one of first and second connectionunits in response to a first control signal of the plurality of controlsignals to interconnect the first node with the second node using theselected connection unit when a second transmission signal of theplurality of transmission signals is enabled, and to select at least oneof third and fourth connection units in response to the second controlsignal to interconnect the second node and a third node of the pluralityof nodes using the selected connection unit when a third transmissionsignal of the plurality of transmission signals is enabled, wherein oneof a first pumping voltage and a second pumping voltage is outputthrough one of the second node and the third node, respectively, to thesemiconductor memory apparatus.
 19. The semiconductor memory apparatusaccording to claim 18, wherein a voltage level of the enabled secondtransmission signal is higher than a voltage level of the enabled firsttransmission signal.
 20. The semiconductor memory apparatus according toclaim 18, wherein the first driving voltage level is substantially thesame as a voltage level of the second transmission signal.
 21. Thesemiconductor memory apparatus according to claim 18, wherein the seconddriving voltage level is higher than the first driving voltage level,and is substantially the same as a voltage level of the enabled thirdtransmission signal.